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Bond-1™ SF
Bond 1-SF is a self-etch, one-coat bonding agent that is solvent-free
— eliminating the need to air dry.
This feature protects against sensitivity and prevents evaporation for stability and consistency.
Bond-1 SF is designed for direct composite restorations and dual cure materials.
* Bond-1 SF provides optimal bond strengths up to 30.4 MPa in just three basic steps: apply evenly, rub for 20 seconds, and light cure.
450,00 جنيه
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الوصف
Product benefits
- Solvent-free – protects against sensitivity, eliminating common technique-sensitive issues such as under- and over-drying; also prevents evaporation
- No air drying – saves you precious chair time; doesn’t leave you guessing “how dry is too dry”
- Self-etch – no need to acid etch; saves time and protects against sensitivity
- Versatile – can be used in conjunction with light cure and dual cure materials*
- Unique handling properties – enables an even spread of the material, ensuring complete coverage and optimal results
- One coat – easy to use; reduces procedure time
Indication
- Direct composite restorations
- Bonding agent for repairs to composite, ceramic and metal substrates
- Pit and fissure sealant
- Compatible with dual cure materials, only when the initial layer is light initiated
*Compatible with dual cure materials only when the initial layer of dual cure material is light cured.
معلومات إضافية
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منتجات ذات صلة
Bond-1™
1.200,00 جنيه
The Bond-1 Primer/Adhesive System is a 5th generation total-etch bonding agent that provides high bond strength in a convenient single-bottle application.
The versatile system bonds both direct and indirect restorations. Bond-1 creates a sealed surface with an intricate network of polymerized primers and unfilled resin.
This results in a high bond strength to dentin of up to 31.0 MPa and a film thickness of only 8μm.
Its ease of application
—combined with its low film thickness
—provides the ideal surface to bond to all types of restorative materials
Etching Gel
300,00 جنيه